BGA-676 (1.0 mm ball pitch, 26 x 26 pin array) to PGA-676 (0.1" pin pitch) adapter.
ENIG finish. High temperature FR4 for leaded or lead-free reflow.
PCB dimensions: 3.5" x 4.4" x 0.063" (88.90 mm x 111.76 mm x 1.6 mm)
PCB construction: FR-4 UL94V-0. PCB operating temperature range: -40C to +130C. PCB reflow maximum temperature: +260C. PCB Assembly standard: IPC-A-610 Class II.
Four corner mounting holes are 3.25 mm in diameter and accept 4-40 screws and stand-offs.
Top side of board fits surface mount footprint, or accepts BGA Socket: Ironwood Electronics P/N: SG-BGA-6009. PCB mounting holes designed to align with socket mounting bolts. NOTE: SOCKET NOT INCLUDED
Through hole pin grid array is split into two halves and fully silkscreen labeled on top and bottom using standard ball grid array numbering format.
1.0 mm diameter PGA holes accept round machine pins or square wire wrap pins.
Datasheet: BGA0034-SOCKET (pdf)