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Board and Stencil Kit. Comes with 2 PCBs, Stencil, Solder Paste, and Mini-Squeegee. Perfect for reflowing hard to solder ICs in the lab, at work or at home.
BGA-25 (8 x 6 mm body width, 1.0 mm pin pitch) to DIP-25 (600 mil body width, 0.1" pin pitch) surface mount adapter.
PCB dimensions: 1000 mils x 1300 mils x 62.5 mils (25.4 mm x 33.02 mm x 1.6 mm).
PCB construction: FR-4 UL94V-0. PCB operating temperature range: -40C to +130C. PCB reflow maximum temperature: +260C.
Top side of board fits surface mount footprint. Bottom side of PCB has pads for two single row surface mount vertical headers, which are included.
This board uses our surface mount male vertical headers, wire wrap or machine pin (selectable above), which are included.
Wire wrap pin P/N: HDR100IMP40M-G-V-SM.
Machine pin P/N: MPH100IMP40M-G-V-SM.
This footprint has been designed to IPC standards. It is recommended that you solder down your chip using the stencil, solder paste and reflow. Toaster oven reflow works well.
Datasheet: IPC0171 (pdf)
AN0001: Circuit Assembly Instructions for PCB and Stencil Kits (pdf)
Videos showing how to use our stencil kits:
Placing the IC:
Reflowing the IC: