Top » Catalog » Stencil Kits (595) » Stencils » PA0206-S

My Account | Cart Contents | Checkout |

Categories

BGA Adapters (38)
Breadboards (68)
Breakout Boards (With IC)
Connector Adapters (32)
DIP to DIP (29)
Discrete to TH (39)
Dual Row to DIP (187)
Dual Row to Dual Row (44)
FPC/FFC to DIP (30)
Headers (45)
Logic ICs to DIP (7)
Pitch Changers (116)
Plastic Case PCBs (5)
Practice Kits (2)
Retail (45)
SMT to DIP (569)
SMT to PGA (35)
SMT to SIP (63)
Socket to DIP (16)
Specific Function (21)
Stencil Kits (595)
  Kits
  PCBs
  Stencils
    BGA
    CSP
    DFN
    Discrete (2 pin)
    HSOP
    JLCC
    LCC
    LFCSP
    LGA
    LLP
    LQFP
    Micro SMD
    Mini SOIC
    MLF
    MLP
    MQFP
    MSOP
    PLCC
    POS
    PowerSOIC
    PQFP
    PSOP
    QFN
    QFP
    QSOP
    RN
    RQFP
    SC
    SOIC
    SON
    SOP
    SOT
    SSOP
    TCSP
    TO
    TQFP
    TSOC
    TSOP
    TSOT
    TSSOP
    TVSOP
    uCSP
    uMAX
    uSOP
    VQFP
    VSOP
    VSSOP
TH to SIP (30)
Tools & Parts (89)
Tools - Development (21)

	Adapter Selection Guide

What's New?

BGA-144 to PGA-144 SMT Adapter (0.5mm pitch, 12 x 12 grid)
$65.99

Information

DFN-16-Exp-Pad (0.5 mm pitch, 5x4 mm body) Steel Stencil

[Part Number: PA0206-S]

$11.59
USD

2 In Stock

Quantity:

Click to enlarge

DFN-16-Exp-Pad (5 x 4 mm body, 0.5 mm pin pitch) stainless steel solder paste stencil.

Stencil Dimensions: 0.9" x 1.3" x 0.004"

This stencil has been designed to work with the following PCB footprint:
Footprint Datasheet: PA0206 (pdf)