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Description:
Custom thickness assembly spacer to hold compact adapter bottom pins so that the top side IC footprint can be stenciled using our stainless steel solder paste stencils. Also holds the bottom side pins in place for secondary reflow after top side IC is placed onto stenciled solder paste.
Designed to handle multiple lead-free (260C) reflow cycles.
Reusable. Suitable for 100+ reflow cycles.
NOTES: Plug compact adapter pins into the smaller holes. The larger holes are there to allow sufficient airflow during reflow to ensure even PCB heating.
Datasheet: COMP-TOP-STENCIL-HELP-1 (pdf)
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