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BGA-25 (0.5 mm ball pitch, 5 x 5 pin array) to DIP-25 (300 mil body width, 0.1" pin pitch) surface mount adapter.
ENIG finish. High temperature FR4 for leaded or lead-free reflow.
PCB dimensions: 0.7" x 1.3" x 0.063" (17.78 mm x 33.02 mm x 1.6 mm)
PCB construction: FR-4 UL94V-0. PCB operating temperature range: -40C to +130C. PCB reflow maximum temperature: +260C. PCB Assembly standard: IPC-A-610 Class II.
Top side of board fits surface mount footprint. Bottom side of PCB has pads for two single row surface mount vertical headers, which are included.
Datasheet: BGA0011 (pdf)
Video showing how to use our pin technology:
Soldering the pins:
The pin rows are held the correct distance apart (either 0.3" or 0.6") using an assembly helper PCB, which comes standard with all orders where the "Unassembled, Pins Included" option is selected.